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3D_Integraton_Packaging_Syllabus and Introduction

Editor: Date:2019-11-14 Hits:19

Contents and Syllabus of the Course

Three-Dimensional Integral Circuit and Packaging: Modeling and Design

The main purpose of this course is to provide fundamentals of 3-D circuit integration and packaging: modeling and design,for M.S. as well as PhD students, including power and signal integrities in 3DICs, and their modeling, simulation and optimization;development of new generation memory: materials, modeling, design, and their applications; miniaturized passive devices for SiP3DIC, and SiP reliability and improvement using 2-D materials for their thermal managementetc. The schedule of this course is given as follows.

 

Lecture.1:From 2D to 3D Integral Circuit (3DIC): Applications and Challenges;

 

Lecture 2: Through-silicon Vias: Lumped-element Circuit Modeling, Electromagnetics and Multiphysics Simulations, and Design;

 

Lecture 3:  Power and Signal Integrities in 3DIC: Modeling, Simulation and Optimization;

 

Lecture 4: From Electromagnetic Compatibility to Multiphysics Compatibility in 3DIC;

 

Lecture 5:Development of New Generation Merry: Materials, Modeling, Design, and Applications;

 

Lecture 5: System in Packaging (SiP): Electromagnetic Modeling and Design;

 

Lecture 6:Miniaturized Passive Devices for SiP;

 

Lecture 7: Multiphysics Modeling and Design of SiP;

 

Lecture 8: 3DIC and SiP Reliability and Improvement: The implementation of 2-D Materials for Thermal Management;

 

Lecture 9: Presentation of theCourse Topic for Each Student.

 

Reference:

1.        Xie, Yuan, Cong, Jingsheng Jason, Sapatnekar, Sachin (Eds.),Three-Dimensional Integrated Circuit Design, 2010 Edition.

2.        M. Swaminathan and K.J. Han, Design and Modeling for 3D ICs and Interposers, World Scientific, Hackensack, NJ, 2014.

3.        M. Swaminathan and R.R. Tummala, System on Package: Miniaturization of the Entire System, The McGraw-Hill Companies, Inc., New York, NY, 2008.

4.        Lecturing Documents Provided by the Lecturer.

 

Introduction

Wen-Yan Yin (M’99-SM’01-F’13) received the M.Sc. degree in electromagnetic field and microwave technique from Xidian University, Xi’an, China, in 1989, and the Ph.D. degree in electrical engineering from Xi’an Jiaotong University, Xi’an, China, in 1994.

He was an Associate Professor with the Department of Electronic Engineering, Northwestern Polytechnic University, Xi’an, from 1993 to 1996. From 1996 to 1998, he was a Research Fellow with the Department of Electrical Engineering, Duisburg University, Duisburg, Germany. Since 1998, he has been with the Monolithic Microwave Integrated Circuit Modeling and Package Laboratory, Department of Electrical Engineering, National University of Singapore (NUS), Singapore, as a Research Fellow. In 2002, he joined Temasek Laboratories, NUS, as a Research Scientist. Since 2005, he has been a full Professor of Electromagnetic Fields and Microwave Techniques with the School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, China, where he is currently Adjunct Ph.D. Candidate Supervisor with the Center for Microwave and RF Technologies. Since 2009, he has joined  Zhejiang University, Hangzhou, China, as a “Qiu Shi” Professor.

As the Lead Author, he has authored over 270 international journal articles (more than 180 IEEE papers), including one international book and 7 book chapters. His current research interests are EMC and electromagnetic protection of communication platforms, computational electromagnetics and multiphysics and their application, and nanoelectronics, etc.

Dr. Yin received the Science and Technology Promotion Award of the First Class from the Local Shanghai Government of China in 2005, the National Technology Invention Award of the Second Class from the Chinese Government in 2008, the National Technology Progress Award of the Second Class from the Chinese Government in 2012, the National Defense Technology Invention Award of the Second Class of 2015,and the best paper awards from the Asia-Pacific Symposium on Electromagnetic Compatibility in 2008 and 2012, etc.

He has been the Associate Editor of IEEE Transactions on Components, Packaging and Manufacturing Technologysince 2011 and IEEE Journal of Multiscale and Multiphysics Computational Techniques since 2016, respectively. He was an Associate Editor of the International Journal of Numerical Modeling: Electronic Networks, Devices and Fields from 2011 to 2016. He was a Guest Editor of the special issue on the IEEE Transactions on Electromagnetic Compatibility. He was an IEEE EMC Society Distinguished Lecturer from 2011 to 2012, and the General Co-Chair of the IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) in 2011 and 2017, technically sponsored by the IEEE Components, Packaging and Manufacturing Technology Committee. He was also the Technical Chair of EDAPS in 2006. He is thereviewer of many international journals, including a lot of IEEE TRANSACTIONS and IEEE LETTERS.

 


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